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  • Srinivas Gopal Krishna, Ph.D., P.Eng.

Srinivas Gopal Krishna, Ph.D., P.Eng.

Consulting Engineer II
Years of Experience:
16
Education & Licenses:

Doctor of Philosophy, Mechanical Engineering, 2007, Louisiana State University, Baton Rouge, LA
− Dissertation: Eigenvalue Optimization and its Application in Buckling and Vibration
Bachelor of Engineering, Mechanical Engineering, 2003, Sri Chandrasekarendra Saraswathi Viswa Maha Vidyalaya (SCSVMV), Kanchipuram, TN, India
Registered Professional Engineer, Province of Alberta

Areas of Specialization:

Fitness for service (FFS)
Finite element analysis (FEA)
Material testing
Strain gauging
Shock & vibration analysis
Failure analysis
Abaqus, ANSYS, LabVIEW, Mathematica
Python, MATLAB

Overview:

Dr. Krishna is a highly skilled mechanical engineer with over a decade of experience specializing in fitness-for-service (FFS) assessments, finite element analysis (FEA), and computational fluid dynamics (CFD).  He has led numerous projects across industries including oil and gas, medical devices, and electronics, focusing on mechanical integrity, failure analysis, and design optimization.  In previous roles, he managed multidisciplinary teams, mentored engineers, and developed custom Python scripts to automate analysis processes.

Publications:

  1. Ramachandran, P., Krishna, S.G., and Ram, Y.M., “Instability of a constrained pendulum system,” American Journal of Physics, Volume 79, Issue 4, page 395, April 2011.
  2. Ram, Y.M. and Krishna, S.G., “Maximizing the least eigenvalue of a constrained affine sum with applications in optimal design of structures and vibrating systems,” proceedings of the Institution of Mechanical Engineers, Part C, Journal of Mechanical Engineering Science, 2008.
  3. Ram, Y.M. and Krishna, S.G., “Discrete model analysis of optimal columns,” ESDA2008-59289, proceedings of the 9th Biennial ASME Conference on Engineering Systems Design and Analysis, Haifa, Israel, 2008.
  4. Krishna, S.G. and Ram, Y.M., “Discrete model analysis of optimal columns,” International Journal of Solids and Structures, Vol. 44, Issues 22-23, pages 7307-7322, Nov 2007.
  5. Krishna, S.G. and Ram, Y.M., “Buckling of stepped thickness plates as a transcendental eigenvalue problem,” proceedings of the 21st Canadian Congress of Applied Mechanics, Toronto, Canada, 2007.
  6. Singh, K.V., Krishna, S.G., Pang, S., and Shukla, A., “Detection of minuscule changes in structures from spectral data,” proceedings of the SPIE Smart Structures and Materials & Nondestructive Evaluation and Health Monitoring, San Diego, CA, 2007.
  7. Krishna, S.G., Singh, K., Li, G., and Pang, S., “Identification of composite beam delamination parameter,” ANTEC 2006 Charlotte Conference Proceedings, Society of Plastic Engineers, Charlotte, NC, 2006.

US Patents:

  • No. 12091936: Rupture Disc Assembly.  Date of Patent: September 17, 2024.  Inventors: Daniel Stannus, Masoud Kalantari, Srinivas Gopal Krishna, Timothy Johnson.
    • Abstract: A rupture disc assembly for use in making a temporary seal in a vessel such as a casing string.  The rupture disc assembly may include a rupture disc having a side surface that has a shallow angle taper inward towards a bottom surface of the rupture disc, and a mounting apparatus to support the rupture disc so that the rupture disc forms the temporary seal.  When a disc working pressure is applied to a top surface of the rupture disc, engagement/force transmission between the rupture disc and the mounting apparatus produces enough radial compression in the rupture disc due to the shallow angle taper to significantly mitigate or cancel tensile stresses, thereby avoiding the rupture disc from breaking.  The rupture disc may be configured to break when the rupture disc is subjected to a disc working pressure that is greater than the disc rupture pressure, thereby removing the temporary seal.
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